In the lifetime prediction simulations of microelectronics solder joints, the stand-off height and misalignment parameters are founded on a variety of estimation methods from very simple to complex approaches. However, the stand-off height and misalignment play essential role in the lifetime of solder joints. Thus, a reliable lifetime simulation requires proper solder geometry model. Many researchers calculate the solder geometry with the software called Surface Evolver, which minimizes the total energy, including the surface tension energy. Some of these studies used energy-based methods for the stand-off height prediction. The first hypothesis is that by changing the predefined value of stand-off height in the Surface Evolver simulation, we gain different total energy values and by differentiating the energy with respect to the stand-off height, we can obtain the vertical force and a nonlinear spring characteristic for the molten solder. Similar results can be found in the literature for BGA. Secondly, it is hypothesized that this spring-like behaviour is observable in horizontal direction too, which is related with the misalignment of the component. The presented approach provides a simple model for the prediction of the stand-off height and misalignment.