In the 21st century, the role of electronic gadgets has reached an unexpected limit where they can literally support every aspect of our lives. Not only have the variety of their knowledge-base and the services they provide reached surprising high levels which are now able to support mobility around the globe, but also these gadgets have created new possibilities to measure, collect and save data. The purpose of this article is to present current packaging methods, but also to investigate and specify the actual stress on our products so that we can quantify the real exposure we want to avoid. The importance of this investigation is that if we could find a method to measure and quantify the correct data of the actual stress, it would provide a effective base for reducing the quantity of the packaging materials used. This is especially the case of those products transported on pallets and therefore we could significantly reduce not only the quantity of the base material used for packaging but also the amount of the left over waste resulting from packaging material globally. As an addition to all the above mentioned factors, the topic also gives an interesting perspective on how the savings on the packaging materials could reduce the cost of these products and so provide companies a way to serve their clients in a more cost effective way and an option to offer their products for a much cheaper price and hence gain a larger market share. © 2013 Taylor & Francis Group.