CT based analysis of reworked BGA devices
Publication Name: 21st Imeko TC 4 International Symposium on Understanding the World Through Electrical and Electronic Measurement and 19th International Workshop on ADC Modelling and Testing
Publication Date: 2016-01-01
Volume: Unknown
Issue: Unknown
Page Range: 288-292
Description:
The widespread use of computed tomography in the electronic field allows for an extended range of measurements to be carried out. High integration devices can be tested easily with μCT, and provide large amount of data to characterize the technology parameters. This paper focuses on the inspection of BGA solder ball geometry and quantification of different properties of the solder arrays.
Open Access: Yes
DOI: DOI not available
